LOCTITE ECCOBOND UF3808 capillary underfill is designed to cure quickly at low ECCOBOND UF3810 LOCTITE UF3808temperatures to minimize stress to other components. Whencured, this material provides excellent mechanical properties toprotect solder joints during thermal cycling.TYPICAL PROPERTIES OF UNCURED MATERIAL UF3838T Viscosity @ 20 s-1 , Cone and Plate, |